The new base of TF AMD (Suzhou) was completed

Today (November 19th), the completion ceremony of the new base of Tongfu AMD (Suzhou) was held, and the unveiling ceremony of Tongfu AMD (Suzhou) Microelectronics Co., Ltd. was also carried out. Liu Xiaotao, the Secretary of the Municipal Party Committee, Shi Lei, the Chairman of Tongfu Microelectronics Group, and Shi Mingda, the Honorary Chairman, attended the ceremony.

Tongfu Microelectronics Group specializes in integrated circuit packaging and testing. It is the fourth - largest packaging and testing enterprise globally. In 2004, it cooperated with AMD in Suzhou to establish Tongfu AMD Semiconductor Co., Ltd. The new base of Tongfu AMD (Suzhou) is another fruit of the strong - strong alliance between the two parties. The project is located in the Jinguang Industrial Park of Suzhou Industrial Park, with a planned land area of 155 mu. It will strive to build the most advanced R & D and production base for high - order processor packaging and testing in China. It is estimated that after reaching full production, the annual output value can reach about 10 billion yuan. Among them, the first phase of the project specializes in FCBGA high - end advanced packaging and testing, and it is expected to achieve mass production in January 2025.

Shi Lei said in his speech that thanks to the efficient services, problem - solving, and support from government departments at all levels in Suzhou, the project has been promoted efficiently and completed smoothly. A new chapter has been opened in the development history of Tongfu Microelectronics Group in Suzhou. We will strive to become the best manufacturer of high - end processor packaging and testing services globally, and repay the deep affection of Suzhou with excellent performance, and jointly create a more brilliant future with Suzhou.